Heat sink for air cooled semiconductor - has diecast metal unit with plate form having radial fins across which forced air flows

摘要

Effective cooling is provided by forced convection of air from a blower being passed across an effective heat sink surface. The heat sink, which is in contact with the devices is produced as a diecasting. The form of the heat sink is such that air is received axially and is deflected through 90 deg. to flow across cooling fins. The fins are arranged to project radially from a hub section. USE/ADVANTAGE - E.g. for computer processor chips. Compact, improved cooling action w.r.t. artificial ventilation provided by fan.