METHOD OF MANUFACTURING FUSIBLE LINKS IN SEMICONDUCTOR DEVICES

摘要

The present invention provides a method of forming fuse ribbons between conductive layers on a semiconductor device. The formation of these fuse ribbons may be at different levels of multiple level integrated circuits. The fuse ribbo ns are formed in a more precise manner than can be obtained conventionally. Resistance control can be easily achieved and significant decreases in dimensions and the use of le ss fuse material can be achieved.