| 摘要 |
PROBLEM TO BE SOLVED: To distinguish an area corresponding to a single chip having a defective pattern from the rest of areas by detecting the defective pattern in the area of the single chip formed on a chip size package CSP tape. SOLUTION: In the title defect inspection device, a CCD camera 40 reads a package pattern on the CSP tape 12, a computer 42 applies image processing to obtained image data to discriminate whether there is any defective pattern. When the computer 42 finds any defective pattern, a puncher placed at a post- stage of the CCD camera 40 punches out a hole for the corresponding package pattern.
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