| 摘要 |
A method for integral semiconductor wafer map recording which comprises taking a semiconductor wafer (11) having a plurality of individual die (12, 13) thereon, testing each of the individual dice (12), summarizing the results of the testing in a wafer map, and recording the wafer map on the semiconductor wafer (11) by laser scribing a binary code (19) within inactive die (13). <IMAGE> |
