| 摘要 |
<p>The present invention relates to a method and a device for removing the protective films (2a, 2b) from insolated printed-circuit boards (4) before the development phase. According to the method, a pressurised jet (E) is sprayed against one edge (9) of the board (4), perpendicular to the edge (9) and in the general plane of the board (9) so as to disbond the adjacent film zones (13a, 13b) of the said edge (9), and then a traction force is exerted on the disbonded zones (13a, 13b) in order to remove the two films (2a, 2b) symmetrically by peeling. The device includes two counter-rotating transporter rollers (7a, 7b) between which the board (4) to be stripped of film is engaged, and interacting with two presser rollers (8a, 8b) intended to grip the zones (13a, 13b) disbonded by the water jet (E) in order to exert the peeling traction force. <IMAGE></p> |
