MODULE FOR IC CARD AND IC CARD

摘要

PROBLEM TO BE SOLVED: To form structure in which an IC chip and a module are reinforced irrespectively of the rear and front surfaces of a card by suppressing a cavity of a die bond material on the lower surface of the IC chip to be equal to or less than specified ratio when the IC chip is mounted on a printed board and setting the thickness of the die bond material in a range of a specified value. SOLUTION: When the IC chip 4 is mounted on the printed board 1, the cavity of the die bond material 2 is suppressed <=10% and the thickness of the die bond material 2 is set in a range of 10 to 20 microns. The die bond material is constituted of an insulation paste and a filler and the filler is spherical silica. The die bond material 2 is brought into contact between the IC chip 4 and the printed board 1 on the chip surface of >=90%. Contained quantity of filler of the die bond material 2 is defined as the one approximated to a material to be molded later and the material of a hard object with high rigidity as high as 80% is used for the die bond material 2. Since the rear surface of the IC chip 4 is brought into contact with the die bond material 2 at larger area, deflection of the IC chip 4 is suppressed.