Plastic encapsulated semiconductor device incorporating a heat sink of metal having controlled roughness contact surfaces, and method of making the same.

摘要

A structure is disclosed which comprises a metal plate (12), a chip of a semiconductor material (13) attached to the plate (12), terminal rheophores (11), interconnection wires (18) between the rheophores (11) and the metallized regions (17) of the chip (13), and a plastics body (10) encapsulating all this with the exception of a surface of the plate (12) and part of the rheophores (11). To achieve improved bond between the plastics and the metal, predetermined areas (30,32,33) of the plate (12) and the rheophores (11) have a higher roughness than 1(Ra=1 mu m).