| 摘要 |
<p>A contact device for an electrical component, particularly a connector, comprising at least one contact element, said contact element having a first contact portion located within said component and a second contact portion projecting downwardly beyond said component and adapted to be connected to a conductor, in particular of a printed circuit board by soldering, wherein said first contact portion consists of resilient metallic material, and said second contact portion separately manufactured consists of a shape memory alloy, said alloy having a transformation temperature which is significantly higher than the operation temperature of said contact device, said contact device being located or oriented, respectively, such that it is deformed towards said conductor, particularly of said printed circuit board above said transformation temperature. <IMAGE></p> |
