| 摘要 |
A lead mounting apparatus is used for mounting leads to an electronic component by utilizing a leadframe which comprises a side band formed integrally with leads each having a clip end portion. The apparatus comprises a transfer mechanism for transferring the leadframe with the respective clip end portions directed upward and located above the component which is supported on one side of the leadframe transfer path; a cutter for cutting the leadframe to provide a frame segment which contains a predetermined number of leads; an operating head arranged ahead of the cutter means on the other side of the leadframe transfer path in opposition to the electronic component to move toward and away from the electronic component; and a row of lead resting teeth provided on the operating head for supporting the frame segment with the clip end portions thereof vertically aligned with the electronic component. |
