发明名称 |
Method for analyzing organic additives in an electroplating bath |
摘要 |
A direct method of analyzing brighteners and levelers used in metal electroplating baths. The method is based on the differential adsorption of these additives on a working electrode during a sequence of steps prior to and during metal plating. The sensitivity of the method allows for the determination of both brightener and leveler in the same sample without cyclic processing.
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申请公布号 |
US5223118(A) |
申请公布日期 |
1993.06.29 |
申请号 |
US19910666798 |
申请日期 |
1991.03.08 |
申请人 |
SHIPLEY COMPANY INC. |
发明人 |
SONNENBERG, WADE;BERNARDS, ROGER;HOULE, PATRICK;FISHER, GORDON |
分类号 |
G01N27/416;C25D21/14;G01N27/42 |
主分类号 |
G01N27/416 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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