| 摘要 |
PURPOSE:To automate a series of work for separating a wafer which has passed through a polishing process from a wafer sticking plate and loading the same on a washing carrier. CONSTITUTION:A wafer sticking plate 1 is rotated on a plate rotating table 21, and when an optical sensor 22 detects a reference point 1a of the wafer sticking plate 1, the rotation is stopped, so that the arm 24 of a wafer separating mechanism 20 is alinged with the center of one sheet of a wafer 3. When a cylinder 27 is operated, the click 26 of a hand 25 bites into a gap between the wafer 3 and the wafer sticking plate 1 to separate the wafer 3. Subsequently, a shaft 23 is rotated to unload the wafer 3 on a wafer transport belt 31, and the wafer 3 is sent into a carrier 2. Such operation cycle is repeated until all wafer sticking plates for on lot are processed. |
