| 摘要 |
Disclosed is an adhesive composition for wood comprising a phenol resin adhesive and a phenol resin highly condensed in a mole ratio (F/P) of formaldehyde (F) to a phenol (P) in the range of 0.8:1 to 1.5:1, having a softening point of 100 DEG to 200 DEG C. and having a number average molecular weight of 2,000 or more, whereby the adhesive is accelerated in hardening to impart fast setting-ability thereto, which causes the pressing temperature to be reduced and makes it possible to raise the allowable moisture content of adherends.
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