发明名称 METHOD AND DEVICE FOR AUTOMATICALLY SOLDERING
摘要 PURPOSE:To reduce the density of oxygen in the soldering device without using the expensive inert gas by burning the combustible gas in the combustion device while circulating the air in the soldering device, flowing back the exhaust gas and filling the inside of soldering device with the exhaust gas. CONSTITUTION:The combustible gas is burned with the air in a carry-in station 6, a soldering room 8 or a carry-out station 9, the oxygen in the air is consumed and the inside of soldering device is filled with the exhaust gas of remarkably low state of 100-1000ppm oxygen density and the soldering is executed. Therefore, the ideal soldering can be executed without oxidizing the lead wire of the molten solder and the electronic part, etc. And the reliability of soldered electronic part can be improved.
申请公布号 JPH05161962(A) 申请公布日期 1993.06.29
申请号 JP19910313337 申请日期 1991.10.31
申请人 YOKOTA KIKAI KK 发明人 YOKOTA SENICHI
分类号 B23K1/008;B23K31/02;B23K101/42;H05K3/34 主分类号 B23K1/008
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