发明名称 APPARATUS FOR MOLDING RESIN SEALING PART FOR ELECTRONIC PART
摘要 PURPOSE:To confirm automatically existence of missing of a diode on a loading frame used for transfer molding. CONSTITUTION:A photoelectric switch 81 is moved along the arrangement of a diode against a loading frame 36. The photoelectric switch 81 is linearly moved by means of a motor 79 through a ball screw 76 and a nut 77. A magnet 87 is fixed on a supporting shaft 83 interlocking with a ball screw 76 through pulleys 84 and 85 and a belt 86 and a magnetic sensor 88 is provided to this magnet 87. When a laser beam from the photographic switch 81 hits a wire 2 of the diode, a pulse is output from the photoelectric switch 81. On every movement of the photoelectric switch 81 by a pitch distance of a wire-fitting groove 39 of the loading frame 36, a pulse is output from a magnet-type sensor 88. Existence and the position of missing of the diode on the loading frame 36 can be detected thereby. It is possible to detect accurately the position of missing.
申请公布号 JPH05162164(A) 申请公布日期 1993.06.29
申请号 JP19910335299 申请日期 1991.12.18
申请人 MITSUBISHI MATERIALS CORP 发明人 MARUYAMA MASAKI
分类号 B22D17/32;B29C45/02;B29C45/17;B29C45/84;B29K105/20;B29L31/34;H01L21/56 主分类号 B22D17/32
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