MANUFACTURING METHOD OF HIGH-FREQUENCY MODULE

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing a high-frequency module having high production efficiency. SOLUTION: This manufacturing method includes an electronic component packaging process 62 that is composed of a plurality of child substrates 22 that have the same circuit pattern and a parent substrate 21 that is formed by interlocking the child substrates 22 and mounts electronic components to the child substrates 22; a process 64 where a slit for electrically separating an integrated signal terminal is provided after the process 62; a process 66 that allows a pin 39 of an inspection tool to come into contact with the signal terminal of trimming by a laser after the process 64; and a separation process 72 that separates the child substrate 22 from the parent substrate 21 after the process 66, thus improving the productivity of the high-frequency module.