发明名称 |
Tape-automated bonding of integrated circuits |
摘要 |
A tape for use in tape-automated-bonding of integrated circuits is disclosed. A series of interconnection arrays ("frames") are arranged along the tape, each array being formed by a number of interconnection beams 3. A terminal ("bump") 6 is located on each beam 3 for bonding to a respective interconnection pad 7 of an integrated circuit 8. Conventional bumps are made of gold-plated copper and have uneven and unyielding bonding surfaces which can fail to provide consistent bonds. The bumps 6 of the tape disclosed comprise a conductive material having a Vickers hardness number of 55 or less, and thus have a compliance which facilitates more even bonding. A method of producing the tape is also disclosed.
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申请公布号 |
US5223321(A) |
申请公布日期 |
1993.06.29 |
申请号 |
US19910774164 |
申请日期 |
1991.10.15 |
申请人 |
BRITISH TELECOMMUNICATIONS PLC |
发明人 |
SINNADURAI, F. NIHAL;SMALL, DAVID J.;BLAIN, ALEXANDER A.;COOPER, KENNETH |
分类号 |
H01L21/48;H01L21/60;H01L23/495;H05K3/40 |
主分类号 |
H01L21/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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