发明名称 METHOD OF MANUFACTURING WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To solve the problem of appearance failure due to burr, breaks, etc., formed when a ceramic board is divided into individual wiring boards. SOLUTION: For cutting off one ceramic board 7 along dividing grooves 6 to form a number of wiring boards, a plurality of metal pieces 5 are formed in a vertical array in regions just beneath the dividing grooves 7 of the ceramic board 7 within a range meeting 0.35&times;(t-c1-c2)<=&Sigma;d<=0.45&times;(t-c1-c2), d<=0.55&times;1+log(c1/w)}, (t: thickness (mm) of insulation base, c1: depth (mm) of the dividing groove at a cut start point, c2: depth (mm) of the dividing groove at a cut end point, w: maximum opening width (mm) of the dividing groove, d: inner diameter (mm) of the metal piece in the vertical direction, &Sigma;d: sum (mm) of the inner diameter of the metal piece in the vertical direction).
申请公布号 JP2002016359(A) 申请公布日期 2002.01.18
申请号 JP20000192747 申请日期 2000.06.27
申请人 KYOCERA CORP 发明人 MATSUDERA HIROSHI
分类号 C04B35/622;H05K3/00;H05K3/46 主分类号 C04B35/622
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