发明名称 MODULAR JACK
摘要 PURPOSE:To provide a modular jack which can suppress the height of installation to a circuit board and contribute itself to height-reduction of apparatuses such as a communication modem. CONSTITUTION:Protruding pieces 4 with hooks 5 are provided on both sides of a mainframe case 2. A modular jack 1 is mounted by fitting its hooks 5 to holes in a circuit board and putting the protruding piece 4 on the circuit board. The connection 7b of a terminal 7 is long enough at least to reach the bottom face of the mainframe case 2.
申请公布号 JPH05159825(A) 申请公布日期 1993.06.25
申请号 JP19910324305 申请日期 1991.12.09
申请人 MURATA MFG CO LTD 发明人 FUKUTANI IWAO;SAITO YASUAKI
分类号 H01R13/33;H01R13/46 主分类号 H01R13/33
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