发明名称 CONDUCTIVE PATH ANNEXED BODY
摘要 PURPOSE:To provide the entitled conductive path annexed body capable of simplifying wire-bonding step, etc., while protecting a circuit pattern. CONSTITUTION:The entitled conductive path annexed body is composed of multiple synthetic resin board 2, 2' laminated with one another wherein the protrusion 4 penetrating into the other board 2' is provided on one laminated board 2 while a synthetic resin film 3 wherein the conductive paths 5 are buried in the junction surface of the board 2 is integrally provided. A part of the film 3 is removed to expose a part of the conductive paths 5 whereto an electronic part is connected and then the electronic part can be buried in the synthetic resin board laminated on the other board.
申请公布号 JPH05160548(A) 申请公布日期 1993.06.25
申请号 JP19910046205 申请日期 1991.02.18
申请人 TOYAMA PARTS:KK 发明人 SHIBUYA TADAMORI;TAKAHASHI YOSHINORI;NINAGAWA HIDEAKI
分类号 B29C45/14;B29L31/34;H05K3/20 主分类号 B29C45/14
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