摘要 |
PURPOSE:To provide the entitled conductive path annexed body capable of simplifying wire-bonding step, etc., while protecting a circuit pattern. CONSTITUTION:The entitled conductive path annexed body is composed of multiple synthetic resin board 2, 2' laminated with one another wherein the protrusion 4 penetrating into the other board 2' is provided on one laminated board 2 while a synthetic resin film 3 wherein the conductive paths 5 are buried in the junction surface of the board 2 is integrally provided. A part of the film 3 is removed to expose a part of the conductive paths 5 whereto an electronic part is connected and then the electronic part can be buried in the synthetic resin board laminated on the other board. |