| 摘要 |
PURPOSE:To enable reduction of the manufacturing cost of the whole circuit substrate by performing double-sided wiring for a first circuit substrate and by performing single-sided wiring for a second circuit substrate whereon the first circuit substrate is mounted. CONSTITUTION:A semiconductor chip is mounted on a first circuit substrate 20 and electrodes 24 of the semiconductor chip and a wiring pattern 26 of the first circuit substrate 20 are connected by a metal wire 25. The semiconductor chip and the metal wire 25 are coated with resin 22, forming a semiconductor device. A second circuit substrate 21 is provided whereon at least one or more semiconductor devices formed in this way are mounted. The first circuit substrate 20 is a double-sided wiring substrate and the second circuit substrate 21 is a single-sided wiring substrate. Since the semiconductor element is mounted on the first circuit substrate 20 without being molded with plastic, the first circuit substrate 20 can be small. Furthermore, since the second circuit substrate 21 has single-sided wiring, the second circuit substrate 21 of a large area has single-sided wiring. Thereby, cost reduction can be realized. |
