| 摘要 |
PURPOSE:To stabilize results of often repeated electrical characteristic tests, and to improve the reliability of wire bonding by increasing or enlarging a probing pad. CONSTITUTION:A probing pad 3 is connected to a circuit section 2 via an interconnection 4, and is also used in the electrical characteristic test and wire- bonding of the circuit section 2. A plurality of probing pads 3 are connected in parallel or series with the interconnection 4. Alternately, the shape of the probing pad 3 is enlarged. Thereby, the probing pads 3 arranged in parallel can be repeatedly subjected to electrical characteristic tests and wirebonding using another probing pad 3. Accordingly, it becomes unnecessary to bring a probe for another test purposes into contact with the same part of the probing pad, whereby results of the tests become stable. In addition, traces of the probe become unnecessary to undergo wire bonding, so that the reliability of wire bonding is improved. |
