| 摘要 |
PURPOSE:To provide a semiconductor device whose electrodes are electrically connected to external electric circuits with accuracy for sure even if its semiconductor element is of high density and has a large-scale integrated circuit and thus a larger number of electrodes. CONSTITUTION:A semiconductor device consists of a substrate 1, external lead terminals 2 and a semiconductor element 3. The substrate 1 has a plurality of metallized wiring layers 4 which fan out from the center to the periphery thereof. Electrodes of the semiconductor element 3 are electrically connected to the metallized wiring layers 4 at the center of the substrate 1; the external lead terminals 2 are electrically connected to the periphery of the substrate 1 as well. In addition, the substrate 1 containing the metallized wiring layers 4, the semiconductor element 3 and part of the external lead terminals are covered with a covering body 6 composed of resin. |
