发明名称 |
MOISTURE RESISTANT STRUCTURE OF MODULE CIRCUIT |
摘要 |
PURPOSE:To provide the entitled moisture resistant structure of a module circuit capable of securing the moisture resistance almost without changing the electric circuit characteristics of strip line easy to form a high-frequency circuit. CONSTITUTION:Within the entitled moisture resistant structure of a module circuit, a strip line 2 of a module board 1 having a high-frequency circuit and a high-frequency device is to be covered with a water repellent porus film 3 in apparent (air bubble containing state) dielectric constant of not exceeding 2.0. |
申请公布号 |
JPH05160558(A) |
申请公布日期 |
1993.06.25 |
申请号 |
JP19910325443 |
申请日期 |
1991.12.10 |
申请人 |
MITSUBISHI ELECTRIC CORP |
发明人 |
FUJIMOTO TAKAMITSU;YANAGIURA SATOSHI;NODA ATSUKO;FUJIWARA TAKEJI;SATO HIROYUKI;BABA FUMIAKI |
分类号 |
H01P1/30;H01P3/08;H01P11/00;H05K3/28 |
主分类号 |
H01P1/30 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|