发明名称 CERAMIC WIRING BOARD
摘要 PURPOSE:To obtain a ceramic wiring board mounting a semiconductor element which board can normally operate the semiconductor element for a long term, by reducing the change of resistance value of a resistor, and restraining waveform perturbation to a minimum which is caused by reflection of a signal travelling a metallized wiring layer. CONSTITUTION:In a ceramic wiring board wherein metallized wiring layers 5a, 5b, 5c and a resistoe 8 are stuck and formed on an insulative substratum 1, the resistor 8 is formed of 100 pts.wt. of metal powder, 10-100 pts.wt. of insulator powder, and 1.0-15.0 pts.wt. of nickel. The metal powder contains 10-60wt.% tungsten powder and 40-90wt.% rhenium powder.
申请公布号 JPH05160538(A) 申请公布日期 1993.06.25
申请号 JP19910324926 申请日期 1991.12.10
申请人 KYOCERA CORP 发明人 SHIMIZU NORIMASA;TERAO SHINYA
分类号 H01B1/16;H01L23/12;H01L23/15;H05K1/16 主分类号 H01B1/16
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