| 摘要 |
PURPOSE:To realize non-flux mounting of semiconductor element onto a board while employing bumps. CONSTITUTION:The method for mounting a semiconductor element to be bonded through a first bump 5 to a first pad 3 formed on a board 1 comprises a step for forming a second bump 4 larger than the first 5 at an arbitrary position on the rear surface 2a of a semiconductor element 2, a second pad 6 at a position corresponding to the second bump 4 on the surface 1a of the board 1, and a third pad 8 to be connected with the second pad 6. The second bump 6 is then bonded to the second pad 6 and the semiconductor element 2 is moved while checking conduction of the third pad 8 and when the third pad 8 is conducted, the first bump 5 is bonded to the first pad 3. |
