| 摘要 |
PURPOSE:To obtain a compact printed board together with a package and obtain a compact system as a whole, by replacing a part of printed board for mounting with a package when assembling a semiconductor chip three- dimensionally. CONSTITUTION:A first semiconductor chip is installed and wire bonding is performed. Then, a die pad plate 22 with a heat sink is mounted by inserting pins 25 into pin holes 8' and 8. After a second semiconductor chip is installed on the die pad plate 22 and wire bonding is performed, potting is performed with a potting resin. A fin 22' for heat dissipation of the die pad plate 22 has a shape protruding out of a package. Thus, heat dissipation of the present semiconductor device can be improved about three times that of the conventional semiconductor device by mounting the die pad plate 22 having a gland conductor or the fin 22' acting to dissipate heat. Further, a lighter weight can be obtained due to no molding, resulting in about one-third the conventional device in weight. |
