| 摘要 |
PURPOSE:To obtain a thin, lightweight lead frame by forming a conductive layer in a pattern on the front face of an insulating tape through etching on which a plurality of semiconductor elements are to be mounted as required and subsequently sticking the back face of this tape to tabs of the lead frame. CONSTITUTION:A Cu foil is stuck to the front face of a polyimide tape 1, and a required wiring pattern is formed thereon through photoetching to obtain parts 8 to mount a plurality of semiconductor elements and so on. The resultant sheet body 10 is stuck to tabs of a lead frame. This enables free and fine wiring in a Cu layer 9, providing a lead frame which accommodates a large number of semiconductor elements and so on. In addition, the lead frame is composed of a sheet body 10 of a very thin polyimide tape 1 and Cu foil stuck together, which makes it thin and lightweight.
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