| 摘要 |
PURPOSE:To facilitate correction of wire cut position when semiconductor chips are wire bonded each other. CONSTITUTION:The inventive semiconductor fabricating system comprises a pattern recognition mechanism for automatically recognizing pads to be bonded on semiconductor chips 2 and 4, and a bonder control section for automatically setting the coordinates of a wire cut point C1 at the time of forming a metal ball 6-1 and the coordinates of a wire cut point C2 after connection of a wire 7 onto the metal ball 6-1 based on information fed from the pattern recognizing mechanism and the diameter of the wire 7. According to the constitution, the wire cut points C1, C2 are corrected automatically when bond points B1, B2 are corrected through the pattern recognizing mechanism. |
