INTERNAL WIRING STRUCTURE OF SEMICONDUCTOR DEVICE

摘要

PURPOSE:To provide an internal wiring structure of a semiconductor device so that an internal lead wide causing oscillation or malfunction is removed and the yield of material is improved and an assembling process is simplified. CONSTITUTION:A wiring block 12 in which a series of internal wirings are formed on lead frames for main circuit and auxiliary circuit and the lead frames are molded as a unit with a holding frame made of resin is sandwiched between a conductor pattern 3 of a circuit substrate on which semiconductor chips 4 and 5 for main circuit and auxiliary circuit are mounted and a terminal block 7 in which outside lead-out terminals 9 and 10 are inserted into a case lid 8. Then, an internal wiring is performed by soldering a terminal connecting part of the circuit substrate side and the outside lead-out terminals 9 and 10 of the terminal block 7 through the wiring block 12.