| 摘要 |
PURPOSE: To provide a method of manufacturing an electronic circuit which is formed taking advantage of a diamond substrate and the diamond substrate, wherein the diamond substrate is protected against cracking, and loose or defective vias are reduced to an irreducible minimum in number. CONSTITUTION: A nearly planar diamond substrate is prepared (110), and a large number of via holes are formed (120) on the diamond substrate penetrating through it. Conductive and reactive brass is filled into (130) the via holes. Brass material and the substrate are heated up to temperatures until the brass material is melted to react with the inner wall surface of the via hole to fuse (140) with the substrate. As an example, the brass material comprises a conductive matrix component which includes, at least, an element selected from among a group composed of copper, silver and gold and a reactive component which includes, at least, an element selected from among a group composed of titanium, chromium, vanadium, zirconium and hafnium. |
