| 摘要 |
PURPOSE:To obtain excellent moisture resistance, hydrolysis resistance, adhesiveness and heat resistance, small voids, small corrosion of an aluminum electrode and high reliability for coping with an increase in size of a semiconductor chip by adhesively fixing a semiconductor chip to a lead frame by using insulation paste containing special composition. CONSTITUTION:A semiconductor chip is adhesively fixed to a lead frame by using insulation paste containing as indispensable ingredients of (A) bismaleimide induced from diaminosiloxane represented by a formula I, (B) epoxy compound of 1, 2-polybutadiene represented by a formula (II) and (C) insulation powder. In the formulae, R<1>, R<2> are bivalent hydrocarbon group, R<3>, R<4> are monovalent hydrocarbon group, in which the R<1> and the R<2>, the R<3> and R<4> may be the same or different, and n is 1 or more integer. The mixing ratio of (A) the bismaleimide and (B) the epoxy compound is desirably 50-95 pts.wt. of the former, and 5-50 pts.wt. of the latter. |
