| 摘要 |
PURPOSE:To eliminate the succeeding printed-wiring step on a board while simplifying the wire-bonding step by a method wherein a conductive path burying synthetic resin film is integrally provided on the outer layer part of the synthetic resin board and then a part of the film surface part is removed by exposing a part of the conductive channel. CONSTITUTION:The entitled conductive channel annexed body 1 is composed of board 2 formed of a synthetic resin and a film 3 in which conductive pats 5 are buried and which is integrally provide on the outer layer of the board 2 when it is formed. Next, a part of the film surface part 3a is removed to expose the conductive parts 5. At this time, the conductive paths 5 not to intersect with one another are buried in the synthetic resin film 3 to be provided in the outer layer part of the board 2 or the conductive paths 5 are provided on a rear layer part film 3b and then the surface layer part film 3a is laminated thereon so that the conductive paths 5 may not intersect with one another between the surface layer part film 3a and the rear layer part film 3b. In such a constitution, an exposed position of the conductive paths 5 is determined by an electronic part 6 connected to the title conductive path annexed body 1. |
