发明名称 FLEXIBLE WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a flexible wiring board, as a flexible wiring board by COF, in which the corrosion of a formal circuit wiring pattern due to the corrosion of a wiring pattern for electroplating can be prevented over a long period even when the wiring pattern for electroplating is cut by a dividing hole. SOLUTION: One or a plurality of formal circuit wiring patterns 3a used to drive a liquid crystal display panel and the wiring pattern 3b for electroplating which is connected to the wiring patterns 3a and which is used to perform an electroplating operation are formed on the surface of a base film 2. Electroplated layers are formed respectively on the patterns, the wiring pattern 3b for electroplating is divided by the dividing hole 4, and the wiring pattern 3b for electroplating is formed redundantly in such a way that a distance up to the dividing hole 4 from the wiring patterns 3a is in a length of 1.5 times or more as compared with a shortest direct distance.
申请公布号 JP2002261426(A) 申请公布日期 2002.09.13
申请号 JP20010054749 申请日期 2001.02.28
申请人 OPTREX CORP 发明人 TANIMOTO HIROSHI;MIKOYAMA MASAKI
分类号 G02F1/1345;H05K1/02;H05K3/22;H05K3/24;(IPC1-7):H05K3/24;G02F1/134 主分类号 G02F1/1345
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