| 摘要 |
PURPOSE:To provide a semiconductor chip module which has such a structure that external shock is not given directly to a heat sink. CONSTITUTION:This module is equipped with a board 2 where a wiring part is provided, a semiconductor chip 7 which is mounted with is circuit face directed toward the wiring part, a heat sink 3 one part of which is in contact with the opposite face to the circuit face of this semiconductor chip 7, a cap 4 in a hole 4 for exposing the other end of this heat sink 3 to outside is made and which envelops the semiconductor chip 7, and a protective fence 5 which envelops the other end of the heat sink 3 exposed from this chip 4. |
