HALBLEITERBAUELEMENT, HERSTELLUNGSVERFAHREN, VORRICHTUNG UND MONTAGEPLATZ.

摘要

A prefabricated plastic cup is fitted with casting resin. A semiconductor body sitting on the inner end of one or more wires has a zone contacting another wire, and a synthetic resin cover. A slot channel engages the leads in part. An outer-lying lead is fitted, with a light press fixing into the corresp. side wall channel of the cup, and the face of at least one inner-lying lead grips into a base channel. The leads held by the side-wall channels may have a nose on their gripped edges. The cavity space of the cup, perpendicular to the plane of the plugged-in leads may be only wide enough for the semiconductor body, leads and cover to be plugged in.