(A) ;MANUFACTURING APPARATUS FOR SEMICONDUCTOR DEVICE

摘要

A cutting apparatus comprising a swinging cutter unit which is pivotally coupled through a first shaft to a stationary working table so as to be swingable about the first shaft between its raised resting position and its lowered cutting position. The swinging cutter unit includes a motor-driven circular saw-blade fixedly mounted on a second shaft coupled to a drive motor, a housing for partially encasing an upper side portion of the circular saw-blade and supporting the second shaft so that the circular saw-blade is rotatable about the second shaft in response to operation of the drive motor, and a blade guard supported by the housing to be rotatable about the second shaft to expose and cover the saw-blade. The blade guard is biased by means of a spring so as to cover the saw-blade and has an engaging device at a portion of the outer surface thereof. An elongated arm is provided such that one end portion thereof is fixedly secured to a stationary portion of the cutting apparatus and the other end portion thereof is positioned near the engaging device. At the other end portion is provided a third shaft engaged with the engaging device so that the blade guard is rotated about the second shaft in response to a swinging movement of the cutter unit to expose the saw-blade when the cutter unit is moving to the cutting position and cover the portion thereof when moving to the resting position.