| 摘要 |
PURPOSE:To easily and accurately mate the end face of a material to be cut off with the slice surface of a slicing device by a method wherein the position of the cut-off surface of the first material to be cut-off is detected and memorized so as to feed back the information of the detected position of the cut-off surface for controlling the cut-off position of following materials to be cut-off. CONSTITUTION:The distance between the center of the cut-off surface of the dummy wafer B2 and a sensor 3 is detected with the sensor 3 is detected with the sensor 3 and the position of the cut-off surface is memorized. A distance between the one end of an ingot and the sensor 3 is detected with the sensor 3 and a work table is controlled so as to make said distance equal to the pre- stored distance in order to start slicing. Thus, the one silicon wafer W, which is adjacent to the first dummy wafer (b) located at the one end of the ingot, is exactly cut-off in two. Further, silicon wafers following the first one are also bisected in regular succession. |
