| 摘要 |
Disclosed is a photosensitive resin composition which, can be hot melt molding and and is water-developable. The composition does not need the preliminary exposure process and when cured has suitable hardness and printing properties. The photosensitive resin composition comprises; (A) a water soluble or water dispersible polyvinyl alcohol prepared by saponifying a copolymer obtained by copolymerizing 90 to 99.9 mol % of a vinyl ester and 0.1 to 10 mol % of an ionic group-containing monomer; said polyvinyl alcohol having a saponification degree of the vinyl ester unit of 60 to 75 mol % and a hot melt flow starting temperature of 95 DEG to 170 DEG C., (B) a polymerizable compound prepared by reacting in the presence of an acid catalyst, (i) N-methylol (meth)acrylamide or N-alkoxymethyl (meth)acrylamide and (ii) a compound selected from the group consisting of monoalcohols, polyhydric alcohols, amides, haloalkylamides, aromatic compounds, ureas and mixtures thereof, and (C) a photopolymerization initiator. The present invention also provides a photosensitive resin plate obtained from the above resin composition, and further provides a particular polymerizable compound which is very suitable for the photosensitive resin composition.
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