| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method for dicing a substrate which can suppress the winding-up of the adhesive of a dicing tape by the injection of cutting water and a dicing blade. <P>SOLUTION: In the surface of a quartz glass substrate 2 with a reflection preventing film, a V channel part 5 in which the distance between the tip part of the dicing blade and the surface of a UV tape adhesive during tape cutless full cut dicing is at least 100μm, and an opening angle is 75°is formed. The tape cutless full cut dicing is done by the dicing blade on a going way. While the substrate is washed on a coming way, to make the dicing blade, above the quartz glass substrate with the reflection preventing film, pass through a position different from a full cut dicing cutting channel position, the quartz substrate with the reflection preventing film is returned to a next going way cutting process starting position for example at 300 mm/s. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
