发明名称 SUBSTRATE ASSEMBLING DEVICE
摘要 PURPOSE:To obtain a device, by which substrates can be pasted together with sealant with no introduction of dust during assembling work. CONSTITUTION:A table 4, which travels between sealant drawing station S1 and substrate pasting station S2, is provided. Further, first substrate 13 is mounted on a stage 5, which travels on the table 4 normal to the travelling direction of the table 4, so as to emit sealant from an emitter, on which a downward directing nozzle tip is provided, and simultaneously move the stage to normal direction in order to draw pattern in S1. Second substrate 14 is horizontally hung with suction table 15 in S2. By moving the table 4 to S2, the first substrate is arranged below the second substrate. Finally, by narrowing the opposing interval between both the substrates, the substrates are pasted together.
申请公布号 JPH05154923(A) 申请公布日期 1993.06.22
申请号 JP19910323138 申请日期 1991.12.06
申请人 HITACHI LTD;HITACHI TECHNO ENG CO LTD 发明人 YONEDA FUKUO;ISHIDA SHIGERU;SANKAI HARUO;KONDO KATSUMI
分类号 B29C65/48;B29C65/78;B29L31/34;B41F17/14;G02F1/13;G02F1/1339;G09F9/00 主分类号 B29C65/48
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