| 摘要 |
Determining the maximum number of dies that fit on a semiconductor wafer is disclosed. The x- and y-coordinates of an initial starting position on a semiconductor wafer are determined. The delta-x and delta-y offsets for subsequent starting positions are also determined. Starting at a current position equal to the initial starting position, the following is repeated for each of a predetermined number of times. First, the semiconductor wafer is covered with fields. Second, the number of dies that are completely covered by the semiconductor wafer is counted. Third, the current starting position is increased by the delta-x and the delta-y offsets. Once this has been repeated, the actual starting position is set as the current starting position at which the number of dies completely covered by the semiconductor wafer is maximized.
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