发明名称 |
Lithographic technique using laser scanning for fabrication of electronic components and the like |
摘要 |
A microlithographic process of fabricating electronic components, such as, for example, integrated circuit chips and thin film read/write heads for computer disk systems, in which a laser is used to etch features defined by a mask. The laser is selected whose radiation will be absorbed by the workpiece being etched, and the masking material is selected so as to be highly reflective of the laser radiation. The masking material is patterned in a conventional manner so as to expose the portions of the workpiece material to be etched. When the laser is directed to the workpiece, the laser radiation etches the portions of the workpiece not protected by the mask. A preferred process of scanning with a laser is disclosed. Etching may be improved if performed under a liquid transparent to the laser radiation.
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申请公布号 |
US5221422(A) |
申请公布日期 |
1993.06.22 |
申请号 |
US19890369714 |
申请日期 |
1989.06.22 |
申请人 |
DIGITAL EQUIPMENT CORPORATION |
发明人 |
DAS, SHYAM C.;KHAN, JAMALUDDIN |
分类号 |
B23K26/00;G03F7/20;G11B5/31;H01L21/027;H01L21/30 |
主分类号 |
B23K26/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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