发明名称 |
Probe with microstrip transmission lines |
摘要 |
A probe for testing integrated circuits includes a stiff elastic substrate including a conductive plane, the substrate having a major portion with fingers projecting therefrom in cantilever fashion. A layer of dielectric material is adhered to the substrate and has a main surface remote from the substrate. A plurality of conductor runs are adhered to the layer of dielectric material at the main surface thereof. The conductor runs extend over at least some of the fingers and are configured to form transmission lines when the conductive plane is connected to a reference potential level.
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申请公布号 |
US5221895(A) |
申请公布日期 |
1993.06.22 |
申请号 |
US19910811855 |
申请日期 |
1991.12.23 |
申请人 |
TEKTRONIX, INC. |
发明人 |
JANKO, BOZIDAR;GARUTS, VALDIS E.;SAUNDERS, J. LYNN |
分类号 |
G01R1/073 |
主分类号 |
G01R1/073 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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