发明名称 MULTILAYER LEAD FRAME
摘要 PURPOSE:To prevent an organic gas from being trapped when the gas is generated by curing an air or an insulation layer between a lead and an insulation layer during an attempt to bond a signal layer with the insulation layer so as to form a multilayer lead frame and enhancing adhesion between the signal layer and molding resin. CONSTITUTION:In a multilayer lead frame which contact-bonds a signal layer which forms leads on the upper layer of a metal plane of a lower layer by way of an insulation layer having an electric insulation properties, a penetration hole or a notch 24 is formed on leads 22 wider than those of a signal layer so as to prevent generation of voids since an air or an organic gas in the insulation layer is trapped between the insulation layer and the leads when they are joined.
申请公布号 JPH05152490(A) 申请公布日期 1993.06.18
申请号 JP19910339678 申请日期 1991.11.28
申请人 SHINKO ELECTRIC IND CO LTD 发明人 FUJII HIROFUMI;TAKEDA YOSHIKI;SHIMIZU MITSUHARU
分类号 H01L23/50 主分类号 H01L23/50
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