| 摘要 |
<p>PURPOSE:To increase a circuit operation speed (A), reduce the size (B), enhance package density (C), prevent deformation and damage of leads (D) and eliminate failure caused during packaging time (E) of a semiconductor device. CONSTITUTION:In a semiconductor device 1, an input/output conversion circuit is installed between an electric circuit 22 loaded on a semiconductor pellet 2 and a signal transmission path in a sealing member where the I/O conversion circuit is designed to convert an electric signal into an optical signal or convert the optical signal into the electric signal, thereby constituting an input/output signal conversion circuit 21. This input/output signal conversion circuit 21 is adapted to be coupled with one end while the other side extends into a sealing member 3 and, what is more, it constitutes an optical signal transmission path 31 exposed to the surface of the sealing member 3.</p> |
