| 摘要 |
<p>PURPOSE: To enable an electronic package, which is made of a modification combined both characteristics of a low specific inductive capacity and a high heat conductivity, by a method wherein the electronic package is formed into such a structure that a layer-substrate boundary is constituted of one surface of a low-K layer and a substrate and the low-K layer consists of a composite material having an opening in a glass-containing matrix. CONSTITUTION: An electronic package comprises a high-heat conductivity substrate and a first low-specific conductive capacity layer (low-K layer) laminated on the substrate, and a layer-substrate boundary is formed of the first surface of the low-K layer and the substrate. The low-K layer consists of a low-K composite material having an opening in a glass-containing matrix. Moreover, the substrate has a metallized layer. In an AlN base which is coated with a metallized layer, for example, and is brought into the state of higher density, an opening glass composite layer brought into the state of higher density is provided on a lead frame 3 which is coupled with an AlN layer 1. Moreover, a plurality of leads 5a and 5b and the like are located on the frame 3 and a metallized layer sealing ring 7 also consists of an opening glass composite material brought into the state of higher density. As a result, a modification of the electronic package, which is low in specific inductive capacity and is high in heat conductivity, can be made.</p> |
