| 摘要 |
PURPOSE:To improve releasability from a die interface and prevent a package crack by adding the remaining mold release to a composition formed by melting the part of the mold release and mixing it with thermosetting resin and inorganic filler. CONSTITUTION:The composition contains thermosetting resin, such as epoxy resin and phenol resin, inorganic filler such as alumina and boron nitride and mold release such as ester wax and hydrocarbon wax. A part of the mold release is melted and mixed with the thermosetting resin and the inorganic filler to form the composition and the remaining mold release is permitted to be added. Namely, the part of the mold release is added to the thermosetting resin, the inorganic filler and the mold release to be melted and mixed. After the composition is powdered, the remaining mold release is added. Thus, excellent crack resistance at the time of mounting and excellent releasability from a die at the time of manufacturing are allowed. |
