| 摘要 |
PURPOSE:To prevent the occurrence of insufficient continuity at the connection between a thick-film via hole and collective which are electrically connected to each other by flattening the surfaces of the glass ceramic section of a board and the thick-film via to the same level of roughness. CONSTITUTION:After both surfaces of a ceramic substrate 1 having a thick-film via 1-2 and in-layer pattern are polished to flat surfaces, the board 1 is subject to pre-processing cleaning and high-temperature baking and both surfaces of the board 1 are cleaned by first-stage dry-polishing. Then, after the surface of the ceramic section 1-1 of the board 1 and exposed surface of the via 1-2 are dry-cleaned by ion milling, the surface of the section 1-1 and exposed surface of the via 1-2 are polished by second-stage dry-polishing. After polishing, a collective 2 is formed by etching the exposed surface of the via 1-2 and surface of the section 1-1 through a sputtering film composed of a conductor. Therefore, the occurrence of insufficient continuity can be prevented at the connection between the via 1-2 and collective 2. |
