| 摘要 |
<p>PURPOSE:To improve the mounting efficiency of electronic parts on a multilayered wiring board. CONSTITUTION:In this multilayered wiring board forming method, thermal pads 3 having clearance holes are formed as the inner layers of a plurality of boards and a hole 11 having a large-diameter section 9 which comes into contact with the pads 3 and a small-diameter section 10 which is spaced from the pads 3 is formed on the inside of the pads 3. When a through hole 12 is formed in the hole 11, a flat pattern and wiring pattern can be connected to each other in various combinations.</p> |
