| 摘要 |
<p>PURPOSE:To enable program data to be inputted into a wire bonding device without errors and lessened in input man-hours even if connection wires are large in number by a method wherein pad recognition codes arranged in prescribed order are provided near to the connection pads of a board. CONSTITUTION:A bare chip IC element is mounted on a board, connection pads are provided to the IC element, and connection pads 7 connected through a wire bonding process are provided to the board. In an integrated circuit board device constituted as above, pad recognition codes 13 arranged in prescribed order are provided near to the board connection pads 7. For instance, the pad recognition codes 13 may be printed in the same process with a silk printing where solder resist used for insulating the board, type, and component number are printed on the board. Or, the pad recognition codes 13 may be formed with the same material with the board connection pads 7 when the pads 7 are formed, and solder resist is added thereon.</p> |
